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AMAT 0090-07135半导体电子分组卡主要特点可以归纳如下：一、高性能高抽速率：AMAT 0090-07135具有高达1200 CFM的抽速率，能够迅速
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AMAT 0090-07135半导体电子分组卡主要特点可以归纳如下：
The main features of AMAT 0090-07135 semiconductor electronic packet card can be summarized as follows:
First, high performance
High pumping rate: The AMAT 0090-07135 has a pumping rate of up to 1200 CFM, which can quickly extract gas from the vacuum chamber to meet the need to quickly establish a vacuum environment during semiconductor manufacturing.
Low noise: Noise levels below 65 dB(A) ensure relatively quiet working conditions for operators in the production environment.
Low vibration: The vibration is less than 0.1g, which helps to reduce the interference of the equipment to the surrounding environment, while protecting the precision components inside the equipment from vibration damage.
Second, long life and reliability
Long life: Design life of more than 40,000 hours, to ensure the long-term stable operation of the equipment, reduce the frequency of replacement and maintenance.
High reliability: The use of mature design and manufacturing processes, through strict quality control and testing, to ensure that the equipment in the complex and changeable semiconductor manufacturing environment has a high degree of reliability.
3, easy to maintain and operate
Simple structure: AMAT 0090-07135 structure design is simple and clear, easy to daily maintenance and troubleshooting.
Automatic control system: Equipped with automatic control system, can achieve automatic operation and fault alarm, reduce the need for manual intervention, improve production efficiency and safety.
Four, oil and gas separation system
Prevention of oil mist pollution: The equipment is equipped with an oil and gas separation system, which can effectively prevent oil mist pollution of the vacuum chamber, ensuring the cleanliness of the semiconductor manufacturing process and product quality.
5. Application fields
Widely used in semiconductor manufacturing: AMAT 0090-07135 is suitable for a variety of semiconductor manufacturing processes, including wafer cleaning, etching, deposition, film deposition and packaging, and is one of the important devices in semiconductor production lines.
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